If a faster temperature rise and fall rate is used, the thermal damage of the test component will be aggravated;

Aging time refers to the duration of the test component in a high-temperature environment, the general range of 24h ~ 168h, can also be adjusted according to the characteristics of the test component.

In addition, in high-temperature aging test, you also need to pay attention to the environmental humidity, generally ranging from 20% to 80%. Reducing humidity can reduce the damage of test components in high temperature environment;

It is also necessary to pay attention to whether the test components are assembled in the PCB, the components assembled on the PCB will be affected by the heat dissipation of the PCB, so the heat dissipation effect of the components should be considered during the test.

Above is the standard of high temperature aging test, which has the main content:

Ambient temperature, temperature rise and fall rate and aging time;

In addition, it is also necessary to consider the environmental humidity and the heat dissipation effect of the test components.

In practical application, it can be adjusted according to the characteristics of different test components to obtain better test results.