- Automatic Soldering Machine
- Automatic Screw-driving Machine
- Automatic Dispensing Machine
- Other Intelligent Production Lines
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Product Description:
This equipment is mainly used for cushioning film automatic laminating equipment, integrating automatic loading and unloading, code scanning, height measurement, mounting, X/Y re-checking, NG discharging and other processes.
Application areas:
3C electronics industry and micro-component mounting process application related industries.
1. Full-automatic loading and unloading mechanism, automatic separation and switching mechanism of material trays, two sets of high-precision linear module handling, greatly improving the efficiency of the equipment;
2. The combination of high-resolution camera and six-axis robot improves the precision and stability of mounting;
3. The application of compact winding tape buffer glue loading mechanism, so that the structure is more compact, improve the placement capacity;
4. The use of high-precision pressure sensors to monitor the pressure monitoring of the press head on the micro-form buffer sheet in real time, to avoid too much or too little pressure, to ensure that each time the pressure preservation is safe and effective;
5. The buffer rubber adopts winding material on the belt to make the equipment structure compact;
6. Adopting high-precision line laser to check the mounting height of the buffer rubber.
Application Efficiency:
1. Solve the ultra-thin micro-small components to absorb, precision mounting to improve the quality of the assembly process, product qualification rate ≥ 99.8%;
2. Robot plus vision real-time alignment mounting, to solve the manual can not meet the precision requirements;
3. Increase capacity, save labor costs, capacity ≥ 1500 pieces/H.
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